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NTD6600N
Power MOSFET
100 V, 12 A, N?Channel,
Logic Level DPAK
Features
? Source?to?Drain Diode Recovery Time Comparable to a
Discrete Fast Recovery Diode
? Avalanche Energy Specified
? Logic Level
? Pb?Free Packages are Available
Typical Applications
? PWM Motor Controls
? Power Supplies
? Converters
MAXIMUM RATINGS (T C = 25 ° C unless otherwise noted)
V (BR)DSS
100 V
G
http://onsemi.com
R DS(on) TYP
118 m W @ 5.0 V
N?Channel
D
I D MAX
12 A
Rating
Symbol
Value
Unit
Drain?to?Source Voltage
Drain?to?Source Voltage (R GS = 1.0 M W )
V DSS
V DGR
100
100
Vdc
Vdc
S
MARKING
Gate?to?Source Voltage
? Continuous
Drain Current ? Continuous @ T A = 25 ° C
Drain Current ? Continuous @ T A =100 ° C
Drain Current ? Pulsed (Note 3)
V GS
I D
I D
I DM
± 20
12
9.0
44
Vdc
Adc
Apk
4
DPAK
CASE 369C
DIAGRAMS
4
Drain
Total Power Dissipation
Derate above 25 ° C
Total Power Dissipation @ T A = 25 ° C (Note 1)
Total Power Dissipation @ T A = 25 ° C (Note 2)
Operating and Storage Temperature Range
P D
T J , T stg
56.6
0.38
1.76
1.28
?55 to
W
W/ ° C
W
W
° C
1 2
3
(Surface Mounted)
STYLE 2
1
Gate
2
Drain
3
Source
+175
Single Pulse Drain?to?Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 50 Vdc, V GS = 5.0 Vdc,
I L = 12 Apk, L = 1.0 mH, R G = 25 W )
Thermal Resistance
E AS
72
mJ
° C/W
4
DPAK?3
CASE 369D
(Straight Lead)
4
Drain
? Junction?to?Case
? Junction?to?Ambient (Note 1)
? Junction?to?Ambient (Note 2)
Maximum Temperature for Soldering
Purposes, (1/8 ″ from case for 10 s)
R q JC
R q JA
R q JA
T L
2.65
85
117
260
° C
1
2
3
STYLE 2
1 2 3
Gate Drain Source
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using the minimum recommended
Y
WW
NT6600
G
= Year
= Work Week
= Device Code
= Pb?Free Package
pad size.
3. Pulse Test: Pulse Width = 10 m s, Duty Cycle = 2%.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
? Semiconductor Components Industries, LLC, 2007
March, 2007 ? Rev. 4
1
Publication Order Number:
NTD6600N/D
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